CVE-2023-33059 — Integer Underflow (Wrap or Wraparound) in INC Snapdragon

CWE-191 — Integer Underflow (Wrap or Wraparound)CWE-787 — Out-of-bounds Write3 documents3 sources
Severity
7.8HIGHNVD
EPSS
0.1%
top 80.75%
CISA KEV
Not in KEV
Exploit
No known exploits
Affected products
2
Qualcomm INC SnapdragonGoogle Android
Timeline
PublishedNov 7
Latest updateNov 14

Description

Memory corruption in Audio while processing the VOC packet data from ADSP.

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HExploitability: 1.8 | Impact: 5.9

Affected Packages2 packages

▶CVEListV5qualcomm_inc/snapdragon253 versions+252

Patches

Patch: www.qualcomm.com ↗Patch: www.qualcomm.com ↗

🔴Vulnerability Details

1
GHSA
GHSA-9qfg-vjxj-gjf3: Memory corruption in Audio while processing the VOC packet data from ADSP↗2023-11-14
▶

📋Vendor Advisories

1
Android
CVE-2023-33059: Audio↗2023-11-01
▶