⚠ Actively exploited
Added to CISA KEV on 2023-12-05. Federal agencies required to patch by 2023-12-26. Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable..

CVE-2023-33063 — Use After Free in INC Snapdragon

CWE-416 — Use After Free6 documents6 sources
Severity
7.8HIGHNVD
EPSS
0.5%
top 36.17%
CISA KEV
KEV
Added 2023-12-05
Due 2023-12-26
Exploit
Exploited in wild
Active exploitation observed
Affected products
2
Qualcomm INC SnapdragonGoogle Android
Timeline
PublishedDec 5
KEV addedDec 5
KEV dueDec 26
CISA Required Action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HExploitability: 1.8 | Impact: 5.9

Affected Packages2 packages

▶CVEListV5qualcomm_inc/snapdragon281 versions+280

Patches

Patch: www.qualcomm.com ↗Patch: www.qualcomm.com ↗

🔴Vulnerability Details

2
GHSA
GHSA-534v-34xw-2g2m: Memory corruption in DSP Services during a remote call from HLOS to DSP↗2023-12-05
▶
VulnCheck
Qualcomm Multiple Chipsets Use-After-Free Vulnerability↗2023
▶

📋Vendor Advisories

2
CISA
Qualcomm Multiple Chipsets Use-After-Free Vulnerability↗2023-12-05
▶
Android
CVE-2023-33063: Kernel↗2023-12-01
▶

🕵️Threat Intelligence

1
Bleepingcomputer
Qualcomm says hackers exploit 3 zero-days in its GPU, DSP drivers↗2023-10-03
▶